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arxiv: 2606.26838 · v1 · pith:2B727CD5new · submitted 2026-06-25 · ❄️ cond-mat.mtrl-sci

HF Etching and Silanization: Evidence for the Role of Surface Hydroxyl Groups in Silicon Nitride Resonator Loss

Pith reviewed 2026-06-26 03:27 UTC · model grok-4.3

classification ❄️ cond-mat.mtrl-sci
keywords silicon nitridenanomechanical resonatorssurface dissipationhydroxyl groupsHF etchingsilanizationquality factorsurface chemistry
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The pith

Surface hydroxyl groups drive mechanical energy loss in silicon nitride resonators, and silanization can cut this loss by up to half.

A machine-rendered reading of the paper's core claim, the machinery that carries it, and where it could break.

The paper tests the effect of surface chemistry on dissipation in thin low-stress Si-rich SiNx membranes by combining HF etching to strip the native oxide with TMCS silanization to add hydrophobic methyl terminations. Surface analysis shows the treatments succeed in removing oxide or changing termination, yet only the silanization step produces large gains in intrinsic quality factor. TMCS raises Q_int by as much as 50 percent while HF alone gives 20-25 percent. Oxide thickness and surface energy show no direct link to the measured loss. The results identify surface hydroxyl groups as the dominant contributor to surface dissipation.

Core claim

The authors show that TMCS silanization, which replaces surface hydroxyls with Si-(CH3)3 groups, yields substantially larger improvements in resonator Q_int than HF etching that removes the native oxide, demonstrating that hydroxyl groups rather than the oxide layer itself are the main source of surface-related mechanical dissipation in SiNx resonators.

What carries the argument

The differential effect of HF oxide removal versus TMCS hydroxyl passivation on measured Q_int, tracked by XPS, photothermal FTIR, and contact-angle data.

Load-bearing premise

The quality-factor gains come specifically from changes to surface hydroxyl groups and not from other side effects of the chemical treatments or from bulk material changes.

What would settle it

A surface treatment that removes or blocks hydroxyl groups without raising Q_int, or an unrelated treatment that raises Q_int without altering hydroxyl coverage, would falsify the link.

Figures

Figures reproduced from arXiv: 2606.26838 by Antonius Armanious, Ariane Giesriegl, Markus Sauer, Nicola Cavalleri, Robert West, Silvan Schmid, Thomas Schachinger.

Figure 1
Figure 1. Figure 1: Three depth profiling methods for the 200 MPa sample. a) Cross-sectional TEM image showing the di [PITH_FULL_IMAGE:figures/full_fig_p003_1.png] view at source ↗
Figure 2
Figure 2. Figure 2: Left: Normalized Si 2p signal measured at 45° with the Si-O, Si-N [PITH_FULL_IMAGE:figures/full_fig_p004_2.png] view at source ↗
Figure 4
Figure 4. Figure 4: The Water Contact Angles for SiNx samples and silicon before and after several treatments. Silicon is included as a reference. The increase in CA can be directly correlated with the surface coverage by the hydrophobic Si−(CH3 ) 3 groups. It shows that all treatments with TMCS increase the CA, while the gas-phase treatment appears to result in a smaller increase than the liquid￾phase treatment, when there w… view at source ↗
Figure 5
Figure 5. Figure 5: The Qint values for both SiNx samples before and after several treat￾ments [PITH_FULL_IMAGE:figures/full_fig_p005_5.png] view at source ↗
Figure 6
Figure 6. Figure 6: Summary of the surface treatments for the 100 MPa sample for four parameters: The native oxide layer thickness (red film), the surface energy (water [PITH_FULL_IMAGE:figures/full_fig_p006_6.png] view at source ↗
Figure 7
Figure 7. Figure 7: Simplified scheme. SiNx surface before and after etching with buffered HF (NH4 F) Si CH3 H3C CH3 O CH3 OH CH3 SiN SiO2 Si Cl H3C CH3 CH3 SiN SiO2 HCl [PITH_FULL_IMAGE:figures/full_fig_p007_7.png] view at source ↗
Figure 8
Figure 8. Figure 8: Simplified scheme. SiNx surface before and after TMCS treatment. • TMCS(g): Samples were placed in a glass chamber un￾der ambient conditions. 1 mL of Trimethylchlorosilane (TMCS) was put into a glass vial inside of the chamber. The chamber was heated to 75°C for 15 minutes and then let to cool off. • TMCS(l): Samples were washed with ethanol abs. and then placed into 19 mL of ethanol abs., into which 1 mL … view at source ↗
read the original abstract

Silicon nitride $SiN_x$ nanomechanical resonators are central to sensing, quantum technologies, and fundamental physics experiments due to their exceptional mechanical quality factors (Q). However, as resonator thickness approaches the nano-scale, surface-related dissipation limits performance. Here, we investigate the role of surface chemistry in low-stress Si-rich SiNx membranes through a combination of hydrofluoric acid (HF) etching and trimethylchlorosilane (TMCS) silanization, correlated with surface characterization and mechanical measurements. Preliminary analysis by TEM-EELS, XPS, RBS/ERDA, and XRR reveals a native oxide surface layer (1-2 nm). Surface modification by HF and TMCS was subsequently evaluated using XPS, photothermal FTIR, contact-angle measurements, and intrinsic quality factor ($Q_{int}$) characterization. While HF etching effectively removes the native oxide and TMCS introduces hydrophobic $Si-(CH_3)_3$ termination, neither oxide thickness nor surface energy correlates with mechanical dissipation. TMCS treatments produce the largest enhancements, increasing $Q_{int}$ by up to 50%, whereas HF etching alone yields lower gains of 20-25%. These findings suggest surface hydroxyl groups as a key contributor to energy loss in $SiN_x$ resonators and demonstrate that chemical functionalization can substantially suppress surface dissipation.

Editorial analysis

A structured set of objections, weighed in public.

Desk editor's note, referee report, simulated authors' rebuttal, and a circularity audit. Tearing a paper down is the easy half of reading it; the pith above is the substance, this is the friction.

Referee Report

2 major / 1 minor

Summary. The manuscript reports experiments on low-stress Si-rich SiNx membranes where HF etching removes the native 1-2 nm oxide layer and TMCS silanization introduces Si-(CH3)3 termination. Surface characterization (XPS, photothermal FTIR, contact angle, TEM-EELS, RBS/ERDA, XRR) is correlated with intrinsic quality factor measurements. The key observations are that oxide thickness and surface energy show no correlation with dissipation, HF alone yields 20-25% Q_int gains, and TMCS yields up to 50% gains, from which the authors conclude that surface hydroxyl groups are a primary loss mechanism and that chemical functionalization can suppress surface dissipation.

Significance. If the attribution of Q_int gains specifically to hydroxyl passivation is substantiated, the result would be significant for resonator design in sensing, quantum technologies, and precision measurements, as it identifies a practical surface-chemistry route to reduce dissipation in thin SiNx devices without relying on oxide thickness or macroscopic surface energy. The combination of multiple surface probes with mechanical characterization is a positive aspect of the experimental design.

major comments (2)
  1. [Abstract] Abstract: the central inference that surface hydroxyl groups are the dominant loss contributor rests on the differential Q_int response to HF versus TMCS without a direct, quantitative correlation between photothermal FTIR OH signal intensity and Q_int across the measured samples; this leaves open the possibility that other uncharacterized treatment effects (bulk defects, stress changes, or additional surface species) drive the observed gains.
  2. [Abstract] Abstract: the reported Q_int increases (20-25% for HF, up to 50% for TMCS) are presented without error bars, sample counts, or statistical tests, so the claimed difference between treatments cannot be evaluated for robustness against measurement variability or confounding variables.
minor comments (1)
  1. [Abstract] The abstract refers to 'preliminary analysis' by TEM-EELS, XPS, RBS/ERDA, and XRR but does not indicate where the full datasets or error estimates for oxide thickness appear in the main text.

Simulated Author's Rebuttal

2 responses · 0 unresolved

We thank the referee for their careful review and constructive comments on our manuscript. We address each major comment below.

read point-by-point responses
  1. Referee: [Abstract] Abstract: the central inference that surface hydroxyl groups are the dominant loss contributor rests on the differential Q_int response to HF versus TMCS without a direct, quantitative correlation between photothermal FTIR OH signal intensity and Q_int across the measured samples; this leaves open the possibility that other uncharacterized treatment effects (bulk defects, stress changes, or additional surface species) drive the observed gains.

    Authors: The inference is grounded in the specific surface chemistry: HF removes the native oxide (containing OH groups) while TMCS targets OH passivation via silanization, yielding larger Q gains. Photothermal FTIR confirms OH signal changes post-treatment, and complementary probes (XPS, contact angle, TEM-EELS, RBS/ERDA, XRR) show no evidence of bulk defects or stress changes. While a direct sample-by-sample quantitative correlation between FTIR OH intensity and Q_int is not presented, the differential response and ruling out of alternatives support the conclusion. We will expand the discussion section to address alternative explanations more explicitly. revision: partial

  2. Referee: [Abstract] Abstract: the reported Q_int increases (20-25% for HF, up to 50% for TMCS) are presented without error bars, sample counts, or statistical tests, so the claimed difference between treatments cannot be evaluated for robustness against measurement variability or confounding variables.

    Authors: We agree that these statistical details are needed for robustness assessment. The reported values are based on measurements from multiple devices across several samples per treatment. In the revised manuscript we will add error bars (standard deviation), specify sample and device counts, and include notes on variability in both the abstract and main text. revision: yes

Circularity Check

0 steps flagged

No circularity: purely experimental correlations with no fitted predictions or self-referential derivations

full rationale

The manuscript reports surface treatments (HF etching, TMCS silanization), characterization (XPS, FTIR, contact angle, TEM-EELS, etc.), and direct Q_int measurements on SiNx resonators. No equations, parameters fitted to subsets of the same data, or theoretical derivations appear. The central inference—that hydroxyl groups contribute to dissipation—is drawn from observed Q_int changes after treatments that alter surface chemistry, but this remains an empirical correlation open to falsification by independent measurements rather than a quantity defined by the same inputs. No self-citation chains or ansatzes are invoked as load-bearing steps. The work is self-contained experimental evidence.

Axiom & Free-Parameter Ledger

0 free parameters · 1 axioms · 0 invented entities

The central claim rests on standard surface-analysis assumptions and the interpretation that Q changes track hydroxyl density; no free parameters, ad-hoc entities, or non-standard axioms are introduced.

axioms (1)
  • domain assumption XPS, FTIR, and contact-angle measurements accurately report surface hydroxyl coverage and hydrophobicity after HF and TMCS treatments.
    Invoked when the paper states that neither oxide thickness nor surface energy correlates with dissipation while inferring hydroxyl involvement.

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Works this paper leans on

59 extracted references · 40 canonical work pages

  1. [1]

    Kanellopulos, R

    K. Kanellopulos, R. G. West, S. Emminger, P. Martini, M. Sauer, A. Foelske, S. Schmid, Stress-dependent opti- cal extinction in low-pressure chemical vapor deposition silicon nitride measured by nanomechanical photother- mal sensing, Nano Letters 24 (36) (2024) 11262–11268. doi:10.1021/acs.nanolett.4c02902

  2. [2]

    Sementilli, E

    L. Sementilli, E. Romero, W. P. Bowen, Nanomechani- cal dissipation and strain engineering, Advanced Func- tional Materials 32 (3) (Aug. 2021).doi:10.1002/ adfm.202105247

  3. [3]

    Schmid, K

    S. Schmid, K. Jensen, K. Nielsen, A. Boisen, Damping mechanisms in high-q micro and nanomechanical string resonators, Physical Review B—Condensed Matter and Materials Physics 84 (16) (2011) 165307

  4. [4]

    Norte, J

    R. Norte, J. Moura, S. Gröblacher, Mechanical resonators for quantum optomechanics experiments at room temper- ature, Physical Review Letters 116 (14) (2016) 147202. doi:10.1103/physrevlett.116.147202

  5. [5]

    Poggio, C

    M. Poggio, C. L. Degen, Force-detected nuclear mag- netic resonance: recent advances and future challenges, Nanotechnology 21 (34) (2010) 342001.doi:10.1088/ 0957-4484/21/34/342001

  6. [6]

    Košata, O

    J. Košata, O. Zilberberg, C. L. Degen, R. Chitra, A. Eich- ler, Spin detection via parametric frequency conversion in a membrane resonator, Physical Review Applied 14 (1) (2020) 014042.doi:10.1103/physrevapplied.14. 014042

  7. [7]

    D. Hälg, T. Gisler, Y . Tsaturyan, L. Catalini, U. Grob, M.-D. Krass, M. Héritier, H. Mattiat, A.-K. Thamm, R. Schirhagl, E. C. Langman, A. Schliesser, C. L. Degen, A. Eichler, Membrane-based scanning force microscopy, Physical Review Applied 15 (2) (2021) l021001.doi: 10.1103/physrevapplied.15.l021001. 9

  8. [8]

    M. A. Page, M. Goryachev, H. Miao, Y . Chen, Y . Ma, D. Mason, M. Rossi, C. D. Blair, L. Ju, D. G. Blair, A. Schliesser, M. E. Tobar, C. Zhao, Gravitational wave detectors with broadband high frequency sensitiv- ity, Communications Physics 4 (1) (Feb. 2021).doi: 10.1038/s42005-021-00526-2

  9. [10]

    Carney, G

    D. Carney, G. Krnjaic, D. C. Moore, C. A. Regal, G. Afek, S. Bhave, B. Brubaker, T. Corbitt, J. Cripe, N. Crisosto, A. Geraci, S. Ghosh, J. G. E. Harris, A. Hook, E. W. Kolb, J. Kunjummen, R. F. Lang, T. Li, T. Lin, Z. Liu, J. Lykken, L. Magrini, J. Manley, N. Matsumoto, A. Monte, F. Mon- teiro, T. Purdy, C. J. Riedel, R. Singh, S. Singh, K. Sinha, J. M. ...

  10. [11]

    Tsaturyan, A

    Y . Tsaturyan, A. Barg, E. S. Polzik, A. Schliesser, Ul- tracoherent nanomechanical resonators via soft clamping and dissipation dilution, Nature nanotechnology 12 (8) (2017) 776–783

  11. [12]

    A. H. Ghadimi, S. A. Fedorov, N. J. Engelsen, M. J. Bereyhi, R. Schilling, D. J. Wilson, T. J. Kippenberg, Elastic strain engineering for ultralow mechanical dissi- pation, Science 360 (6390) (2018) 764–768

  12. [13]

    Adhikari, H

    L. Villanueva, S. Schmid, Evidence of surface loss as ubiquitous limiting damping mechanism in sin micro- and nanomechanical resonators, Physical Review Letters 113 (22) (2014) 227201.doi:10.1103/physrevlett. 113.227201

  13. [14]

    Schmid, T

    S. Schmid, T. Bagci, E. Zeuthen, J. M. Taylor, P. K. Her- ring, M. C. Cassidy, C. M. Marcus, L. Guillermo Vil- lanueva, B. Amato, A. Boisen, Y . Cheol Shin, J. Kong, A. S. Sørensen, K. Usami, E. S. Polzik, Single-layer graphene on silicon nitride micromembrane resonators, Journal of Applied Physics 115 (5) (Feb. 2014).doi: 10.1063/1.4862296

  14. [15]

    T. Ono, M. Esashi, Effect of ion attachment on mechanical dissipation of a resonator, Applied Physics Letters 87 (4) (Jul. 2005).doi:10.1063/1.1993771

  15. [16]

    Héritier, R

    M. Héritier, R. Pachlatko, Y . Tao, J. M. Abendroth, C. L. Degen, A. Eichler, Spatial correlation between fluctuat- ing and static fields over metal and dielectric substrates, Physical Review Letters 127 (21) (2021) 216101.doi: 10.1103/physrevlett.127.216101

  16. [17]

    Luhmann, A

    N. Luhmann, A. Jachimowicz, J. Schalko, P. Sadeghi, M. Sauer, A. Foelske-Schmitz, S. Schmid, Effect of oxy- gen plasma on nanomechanical silicon nitride resonators, Applied Physics Letters 111 (6) (Aug. 2017).doi:10. 1063/1.4989775

  17. [18]

    Y . Tao, P. Navaretti, R. Hauert, U. Grob, M. Poggio, C. L. Degen, Permanent reduction of dissipation in nanome- chanical si resonators by chemical surface protection, Nanotechnology 26 (46) (2015) 465501.doi:10.1088/ 0957-4484/26/46/465501

  18. [19]

    J. A. Henry, Y . Wang, M. A. Hines, Effect of surface chemistry on the quality factors of micromechanical res- onators, in: Micro- and Nanotechnology Sensors, Sys- tems, and Applications III, SPIE, 2011, p. 80311A.doi: 10.1117/12.883185

  19. [20]

    Kinkel, K

    J. Kinkel, K. Unger, Role of solvent and base in the silanization reaction of silicas for reversed-phase high- performance liquid chromatography, Journal of Chro- matography A 316 (1984) 193–200.doi:10.1016/ s0021-9673(00)96151-x

  20. [21]

    Szkop, B

    M. Szkop, B. Kliszcz, A. A. Kasprzak, A simple and re- producible protocol of glass surface silanization for tirf microscopy imaging, Analytical Biochemistry 549 (2018) 119–123.doi:10.1016/j.ab.2018.03.020

  21. [22]

    Maharanwar, J

    A. Maharanwar, J. J. Weimer, Analysis of the uptake of chlorotrimethylsilane on glass from toluene solution- phase depositions, Surfaces and Interfaces 7 (2017) 29– 38, aFM.doi:10.1016/j.surfin.2017.01.007

  22. [23]

    Rezayi, M

    T. Rezayi, M. H. Entezari, Achieving to a superhydropho- bic glass with high transparency by a simple sol–gel-dip- coating method, Surface and Coatings Technology 276 (2015) 557–564.doi:10.1016/j.surfcoat.2015. 06.015

  23. [24]

    A. Y . Fadeev, T. J. McCarthy, Self-assembly is not the only reaction possible between alkyltrichlorosilanes and surfaces: Monomolecular and oligomeric covalently at- tached layers of dichloro- and trichloroalkylsilanes on sil- icon, Langmuir 16 (18) (2000) 7268–7274.doi:10. 1021/la000471z

  24. [25]

    L.-H. Liu, D. J. Michalak, T. P. Chopra, S. P. Pujari, W. Cabrera, D. Dick, J.-F. Veyan, R. Hourani, M. D. Halls, H. Zuilhof, Y . J. Chabal, Surface etching, chemical modi- fication and characterization of silicon nitride and silicon oxide—selective functionalization of si3n4and sio2, Jour- nal of Physics: Condensed Matter 28 (9) (2016) 094014. doi:10.108...

  25. [26]

    Coffinier, R

    Y . Coffinier, R. Boukherroub, Surface modification of sil- icon nanowires for biosensing, Elsevier, 2022, Ch. Three, pp. 25–68.doi:10.1016/b978-0-12-821351-3. 00017-3

  26. [27]

    S. I. Raider, R. Flitsch, J. A. Aboaf, W. A. Pliskin, Sur- face oxidation of silicon nitride films, Journal of The Electrochemical Society 123 (4) (1976) 560–565.doi: 10.1149/1.2132877. 10

  27. [28]

    J. A. Wurzbach, F. J. Grunthaner, Compositional depth profile of a native oxide lpcvd mnos structure using x-ray photoelectron spectroscopy and chemical etching, Journal of The Electrochemical Society 130 (3) (1983) 691–699. doi:10.1149/1.2119784

  28. [29]

    Greil, R

    P. Greil, R. Nitzsche, H. Friedrich, W. Hermel, Evaluation of oxygen content on silicon nitride powder surface from the measurement of the isoelectric point, Journal of the European Ceramic Society 7 (6) (1991) 353–359.doi: 10.1016/0955-2219(91)90058-8

  29. [30]

    Lamagna, C

    L. Lamagna, C. Wiemer, M. Perego, S. Spiga, J. Ro- dríguez, D. Santiago Coll, M. E. Grillo, S. Klejna, S. D. Elliott, Mechanisms for substrate-enhanced growth dur- ing the early stages of atomic layer deposition of alu- mina onto silicon nitride surfaces, Chemistry of Materials 24 (6) (2012) 1080–1090.doi:10.1021/cm203362d

  30. [31]

    Pezzotti, The surface chemistry of silicon nitride, in: Silicon Nitride Bioceramics, Springer, 2024, pp

    G. Pezzotti, The surface chemistry of silicon nitride, in: Silicon Nitride Bioceramics, Springer, 2024, pp. 101–123

  31. [32]

    Brunet, D

    M. Brunet, D. Aureau, P. Chantraine, F. Guillemot, A. Etcheberry, A. C. Gouget-Laemmel, F. Ozanam, Etch- ing and chemical control of the silicon nitride surface, ACS Applied Materials I& Interfaces 9 (3) (2017) 3075– 3084.doi:10.1021/acsami.6b12880

  32. [33]

    Schmid, L

    S. Schmid, L. G. Villanueva, M. L. Roukes, Fundamentals of Nanomechanical Resonators, Springer International Publishing, 2023.doi:10.1007/978-3-031-29628-4

  33. [34]

    J.; Lill, T.; Hudson, E

    P. Temple-Boyer, C. Rossi, E. Saint-Etienne, E. Scheid, Residual stress in low pressure chemical vapor deposition sinx films deposited from silane and ammonia, Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films 16 (4) (1998) 2003–2007.doi:10.1116/1. 581302

  34. [35]

    S. Han, R. Yang, C. Li, L. Yang, The wettability and numerical model of different silicon microstructural sur- faces, Applied Sciences 9 (3) (2019) 566.doi:10.3390/ app9030566

  35. [36]

    P. Bryk, E. Korczeniewski, G. S. Szyma ´nski, P. Kowal- czyk, K. Terpiłowski, A. P. Terzyk, What is the value of water contact angle on silicon?, Materials 13 (7) (2020) 1554.doi:10.3390/ma13071554

  36. [37]

    Bohling, W

    C. Bohling, W. Sigmund, Self-limitation of native oxides explained, Silicon 8 (3) (2015) 339–343.doi:10.1007/ s12633-015-9366-8

  37. [38]

    Giesriegl, J

    A. Giesriegl, J. Blaschke, S. Naghdi, D. Eder, Rate- limiting steps of dye degradation over titania-silica core- shell photocatalysts, Catalysts 9 (7) (2019) 583.doi: 10.3390/catal9070583

  38. [39]

    Lisovskyy, M

    I. Lisovskyy, M. V oitovych, A. Sarikov, S. Zlobin, A. Lukianov, O. Oberemok, O. Dubikovsky, Infrared study of the structure of silicon oxynitride films pro- duced by plasma enhanced chemical vapor deposition, Journal of Non-Crystalline Solids 617 (2023) 122502. doi:10.1016/j.jnoncrysol.2023.122502

  39. [40]

    Laades, M

    A. Laades, M. Burkhardt, M. Roczen, C. Klimm, M. Blech, A. Lawerenz, Detailed investigation of the structural and passivation properties of silicon oxynitrides for silicon solar cells, physica status solidi c 9 (10–11) (2012) 2124–2127.doi:10.1002/pssc.201200245

  40. [41]

    Rebib, E

    F. Rebib, E. Tomasella, E. Bêche, J. Cellier, M. Jacquet, Ftir and xps investigations of a-sioxny thin films struc- ture, Journal of Physics: Conference Series 100 (8) (2008) 082034.doi:10.1088/1742-6596/100/8/082034

  41. [42]

    Fubini, M

    B. Fubini, M. V olante, V . Bolis, E. Giamello, Reactivity towards water of silicon nitride: Energy of interaction and hydration dehydration mechanism, Journal of Ma- terials Science 24 (2) (1989) 549–556.doi:10.1007/ bf01107440

  42. [43]

    Harame, L

    D. Harame, L. Bousse, J. Shott, J. Meindl, Ion-sensing devices with silicon nitride and borosilicate glass insula- tors, IEEE Transactions on Electron Devices 34 (8) (1987) 1700–1707.doi:10.1109/t-ed.1987.23140

  43. [44]

    J. Yang, T. Ono, M. Esashi, Energy dissipation in submi- crometer thick single-crystal silicon cantilevers, Journal of Microelectromechanical Systems 11 (6) (2002) 775– 783.doi:10.1109/jmems.2002.805208

  44. [45]

    D. Chen, A. Kovach, X. Shen, S. Poust, A. M. Armani, On-chip ultra-high-q silicon oxynitride optical resonators, ACS Photonics 4 (9) (2017) 2376–2381.doi:10.1021/ acsphotonics.7b00752

  45. [46]

    Shimizu, J.-J

    H. Shimizu, J.-J. Delaunay, R. Kometani, S. Wari- sawa, S. Ishihara, Evaluation of resonance characteris- tics change of silicon resonators due to surface treat- ment, Japanese Journal of Applied Physics 49 (6S) (2010) 06GN13.doi:10.1143/jjap.49.06gn13

  46. [47]

    C. Wu, S. H. Zandavi, C. A. Ward, Prediction of the wet- ting condition from the zeta adsorption isotherm, Phys. Chem. Chem. Phys. 16 (46) (2014) 25564–25572.doi: 10.1039/c4cp03585b

  47. [48]

    L. J. M. Schlangen, L. K. Koopal, M. A. C. Stuart, J. Lyk- lema, M. Robin, H. Toulhoat, Thin hydrocarbon and wa- ter films on bare and methylated silica: Vapor adsorption, wettability, adhesion, and surface forces, Langmuir 11 (5) (1995) 1701–1710.doi:10.1021/la00005a045

  48. [49]

    Heil, Philip M

    M. Della Ciana, A. Kovtun, C. Summonte, A. Candini, D. Cavalcoli, D. Gentili, R. Nipoti, C. Albonetti, Na- tive silicon oxide properties determined by doping, Lang- muir 39 (35) (2023) 12430–12451.doi:10.1021/acs. langmuir.3c01652. 11

  49. [50]

    L. Chen, X. He, H. Liu, L. Qian, S. H. Kim, Water ad- sorption on hydrophilic and hydrophobic surfaces of sili- con, The Journal of Physical Chemistry C 122 (21) (2018) 11385–11391.doi:10.1021/acs.jpcc.8b01821

  50. [51]

    T. H. Muster, C. A. Prestidge, R. A. Hayes, Water ad- sorption kinetics and contact angles of silica particles, Colloids and Surfaces A: Physicochemical and Engineer- ing Aspects 176 (2-3) (2001) 253–266.doi:10.1016/ s0927-7757(00)00600-2

  51. [52]

    Cavalleri, A

    N. Cavalleri, A. Giesriegl, R. G. West, K. Kanellopulos, D. Nazzari, P. Sadeghi, E. C. Langman, A. Schliesser, S. Schmid, Reduction of surface losses in silicon nitride resonators through thermal annealing in ultrahigh vac- uum, [manuscript unpublished] (2026)

  52. [53]

    D. K. Owens, R. C. Wendt, Estimation of the surface free energy of polymers, Journal of Applied Polymer Science 13 (8) (1969) 1741–1747.doi:10.1002/app.1969. 070130815

  53. [54]

    Schell, C

    F. Schell, C. Zwahr, A. F. Lasagni, Surfalize: A python library for surface topography and roughness analysis designed for periodic surface structures, Nanomaterials 14 (13) (2024) 1076.doi:10.3390/nano14131076

  54. [55]

    Timarac-Popovi ´c, J

    J. Timarac-Popovi ´c, J. Hiesberger, E. Šesto, N. Luh- mann, A. Giesriegl, H. Beši ´c, J. P. Lafleur, S. Schmid, Picogram-level nanoplastic analysis with nanoelectrome- chanical system fourier transform infrared spectroscopy: Nems-ftir, ACS Nano 20 (14) (2026) 11193–11208.doi: 10.1021/acsnano.5c22099

  55. [56]

    M. P. Seah, S. J. Spencer, Ultrathin sio2 on si ii. issues in quantification of the oxide thickness, Surface and In- terface Analysis 33 (8) (2002) 640–652.doi:10.1002/ sia.1433

  56. [57]

    Hesse, P

    R. Hesse, P. Streubel, R. Szargan, Improved accuracy of quantitative xps analysis using predetermined spec- trometer transmission functions with unifit 2004, Surface and Interface Analysis 37 (7) (2005) 589–607.doi: 10.1002/sia.2056

  57. [58]

    Müller, N

    A. Müller, N. Cavalleri, A. Glavic, C. Cancellieri, P. Mar- sik, G. Benga, A. Giesriegl, L. Jeurgens, S. Schmid, A. Eichler, G. Jeschke, A. Armanious, In-depth character- ization of silicon nitride thin membranes: hydrogen and paramagnetic defects as candidate surface-related dissipa- tion channels, [unpublished manuscript] (2026)

  58. [59]

    Tanuma, C

    S. Tanuma, C. J. Powell, D. R. Penn, Calculations of elec- tron inelastic mean free paths. v. data for 14 organic com- pounds over the 50–2000 ev range, Surface and Interface Analysis 21 (3) (1994) 165–176.doi:10.1002/sia. 740210302

  59. [60]

    Glavic, M

    A. Glavic, M. Björck, GenX 3: the latest genera- tion of an established tool, Journal of Applied Crys- tallography 55 (4) (2022) 1063–1071.doi:10.1107/ S1600576722006653. 12 Supplementary Information S1. Q andQ int plot Figure S1 shows the Qs and intrinsic Qs (Qint) for modesn 2 +j 2 ≤100. The lines in the top plot represent the envelope from the mean of ...