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Benchmarking Emerging Cavity-Mediated Quantum Interconnect Technologies for Modular Quantum Computers

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arxiv 2407.15651 v1 pith:BHSZIQ7K submitted 2024-07-22 quant-ph

Benchmarking Emerging Cavity-Mediated Quantum Interconnect Technologies for Modular Quantum Computers

classification quant-ph
keywords quantumcavity-mediatedcomputersinterconnectbenchmarkingcommunicationmodularqubit
verification ladder T0 review T1 audit T2 compute T3 formal T4 reserved
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Modularity is a promising approach for scaling up quantum computers and therefore integrating higher qubit counts. The essence of such architectures lies in their reliance on high-fidelity and fast quantum state transfers enabled by generating entanglement between chips. In addressing the challenge of implementing quantum coherent communication channels to interconnect quantum processors, various techniques have been proposed to account for qubit technology specifications and the implemented communication protocol. By employing Design Space Exploration (DSE) methodologies, this work presents a comparative analysis of the cavity-mediated interconnect technologies according to a defined figure of merit, and we identify the configurations related to the cavity and atomic decay rates as well as the qubit-cavity coupling strength that meet the efficiency thresholds. We therefore contribute to benchmarking contemporary cavity-mediated quantum interconnects and guide the development of reliable and scalable chip-to-chip links for modular quantum computers.

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Cited by 1 Pith paper

Reviewed papers in the Pith corpus that reference this work. Sorted by Pith novelty score.

  1. Optimizing Inter-chip Coupler Link Placement for Modular and Chiplet Quantum Systems

    quant-ph 2025-09 conditional novelty 6.0

    InterPlace selects inter-chip coupler placements in modular quantum systems via a multi-objective cost model, cutting SWAPs and inter-chip operations by up to 33.3% and boosting simulated fidelity by up to 53.0%.