Paper Citation Record · LEDGER

Flip-chip integrated superconducting qubits using electroplated bump bonds

As of 13 August 2026, this Paper Citation Record lists 43 of 43 outbound references and 1 inbound Pith citation observation for arXiv:2608.07306.

A citation records a reference. It does not transfer a finding from one paper to another.

pith.paper-citation-record.v1
2608.07306 v1

Coverage vector

measured 43 of 43 reference resolution

Typed states for the displayed outbound observations.

Source: paper_references, paper_reference_links, observed 2026-08-10T10:46:14.249353Z

measured 44 of 44 standing notices

One-hop event checks from named stored sources.

Source: scholarly_work_events, retraction_status_cache, observed 2026-08-12T06:34:41.77262+00:00

measured 1 of 1 inbound itemization

Pith citing papers itemized under the disclosed page cap.

Source: paper_references, paper_reference_links, observed 2026-08-10T10:46:14.076290Z

measured 0 of 1 external citation measurements

A source-named dated measurement, never combined with another source.

Source: pith, observed 2026-08-10T10:46:14.569868Z

Reference resolution

43 of 43 outbound references displayed

verified exact1
verified fuzzy20
unresolved21
parse uncertain0
malformed identifier1
metadata mismatch0

External citation measurements

No source-named external measurement is stored.

Outbound references

Observation 3c4e75b7-e7a1-476b-9897-aff063a0f4ef · outbound

This paper cites Acharyaet al., Quantum error correction below the surface code threshold, Nature638, 920 (2025).

Flip-chip integrated superconducting qubits using electroplated bump bonds Acharyaet al., Quantum error correction below the surface code threshold, Nature638, 920 (2025)

Reference 1

Resolution: unresolved; no resolver link, observed 2026-08-10T10:46:14.083039Z

Source-reported events for the cited work

Unavailable: canonical work link unavailable.

Observation f87dac37-1027-47b1-89cf-b446304b9f3c · outbound

This paper cites Carrera Vazquez, C.

Flip-chip integrated superconducting qubits using electroplated bump bonds Carrera Vazquez, C

Reference 2

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:15.058634Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 4281ac90-8ba5-43ed-b3be-49f5033c9535 · outbound

This paper cites Aruteet al., Quantum supremacy using a pro- grammable superconducting processor, Nature574, 505 (2019).

Flip-chip integrated superconducting qubits using electroplated bump bonds Aruteet al., Quantum supremacy using a pro- grammable superconducting processor, Nature574, 505 (2019)

Reference 3

Resolution: unresolved; no resolver link, observed 2026-08-10T10:46:14.092213Z

Source-reported events for the cited work

Unavailable: canonical work link unavailable.

Observation 541164bd-fff0-4699-9892-7ab9b694bc65 · outbound

This paper cites Blais, S.

Flip-chip integrated superconducting qubits using electroplated bump bonds Blais, S

Reference 4

Resolution: unresolved; no resolver link, observed 2026-08-10T10:46:14.096344Z

Source-reported events for the cited work

Unavailable: canonical work link unavailable.

Observation 37e4f29c-9f3e-4ec1-a907-331aa21c4217 · outbound

This paper cites Kosenet al., Building blocks of a flip-chip integrated superconducting quantum processor, Quantum Science and Technology7, 035018 (2022).

Flip-chip integrated superconducting qubits using electroplated bump bonds Kosenet al., Building blocks of a flip-chip integrated superconducting quantum processor, Quantum Science and Technology7, 035018 (2022)

Reference 5

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:15.027761Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 64038438-b366-466d-a1a1-e174bc474e70 · outbound

This paper cites Rosenberg, D.

Flip-chip integrated superconducting qubits using electroplated bump bonds Rosenberg, D

Reference 6

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:15.012945Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 31ba3213-9d31-45ff-a03d-888b4acd8f8e · outbound

This paper cites Brecht, W.

Flip-chip integrated superconducting qubits using electroplated bump bonds Brecht, W

Reference 7

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.999762Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 8d35ffa0-fc43-4e8b-978c-65e42f148c3c · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 8

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.986152Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 1951bb89-ffb9-4d2c-9395-e4d2712d2565 · outbound

This paper cites Scappucci, C.

Flip-chip integrated superconducting qubits using electroplated bump bonds Scappucci, C

Reference 9

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.973427Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 48c81d7b-6a62-49ca-ae53-0b3c3bbfb53c · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 10

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.960210Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 754589d9-58f6-44dc-b28c-791dcf96a03d · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 11

Resolution: unresolved; no resolver link, observed 2026-08-10T10:46:14.125798Z

Source-reported events for the cited work

Unavailable: canonical work link unavailable.

Observation 4f142fb6-8094-46b1-8c69-b258acc2d98f · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 12

Resolution: unresolved; no resolver link, observed 2026-08-10T10:46:14.129828Z

Source-reported events for the cited work

Unavailable: canonical work link unavailable.

Observation fc9254fa-563c-4e69-bb9c-199b765d1cd0 · outbound

This paper cites Foxen, J.

Flip-chip integrated superconducting qubits using electroplated bump bonds Foxen, J

Reference 13

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.938772Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 811cb184-ba2c-41d5-87c1-c5cd058a6d22 · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 14

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.926415Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation f6096e05-b532-497f-92c7-b4e5db550572 · outbound

This paper cites Granel, F.

Flip-chip integrated superconducting qubits using electroplated bump bonds Granel, F

Reference 15

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.914025Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 5d2ff109-1d20-4277-a0a8-7fe49ca761fe · outbound

This paper cites Kosen, H.-X.

Flip-chip integrated superconducting qubits using electroplated bump bonds Kosen, H.-X

Reference 16

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.901647Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 089e668a-6366-43eb-a0bb-90a711b6f9bb · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 17

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.888872Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 419d2cc0-cd61-4534-8e05-854db4695391 · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 18

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.876239Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 6a22a854-ab18-4a1b-955e-2be54651ecb4 · outbound

This paper cites Telkamp, T.

Flip-chip integrated superconducting qubits using electroplated bump bonds Telkamp, T

Reference 19

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.863837Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation afac07fe-c6ec-4b06-b536-74ab522eea4a · outbound

This paper cites Hinderling, D.

Flip-chip integrated superconducting qubits using electroplated bump bonds Hinderling, D

Reference 20

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.850860Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 846e2868-eee6-4792-8a03-258132d29344 · outbound

This paper cites Hinderling, S.

Flip-chip integrated superconducting qubits using electroplated bump bonds Hinderling, S

Reference 21

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.838129Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation b43ccbd0-c1fb-4c62-b08d-b00bd80b565a · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 22

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.825296Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation f15dd852-547f-4371-9a03-73e1531c5f4c · outbound

This paper cites Holman, D.

Flip-chip integrated superconducting qubits using electroplated bump bonds Holman, D

Reference 23

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.812383Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation fa2159c1-fd01-460f-bb60-bf0b1f57ea3f · outbound

This paper cites Jiang, S.

Flip-chip integrated superconducting qubits using electroplated bump bonds Jiang, S

Reference 24

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.798973Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 0ec2cecd-52c7-469f-96f1-54e49d3d39f8 · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 25

Resolution: verified exact; doi, observed 2026-08-10T10:46:14.283822Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation b297861a-0d48-415b-802b-d4f26e2e3235 · outbound

This paper cites Gharibaanet al., (in preparation) (to appear), (2026).

Flip-chip integrated superconducting qubits using electroplated bump bonds Gharibaanet al., (in preparation) (to appear), (2026)

Reference 26

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.784079Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 27f856be-758b-40d9-bb0c-8f89eee3182d · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 27

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.771131Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 85e90e55-4a10-4d76-a347-eaeb84b57bf6 · outbound

This paper cites Makita, S.

Flip-chip integrated superconducting qubits using electroplated bump bonds Makita, S

Reference 28

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.758420Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation daf0140e-1029-4329-b5d8-23257b87d279 · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 29

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.745698Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation b649b177-d091-46e6-9bf6-cf540d9888a8 · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 30

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.732903Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation e50631d9-64c6-4466-b442-b94f97dac00c · outbound

This paper cites Dunsworth, A.

Flip-chip integrated superconducting qubits using electroplated bump bonds Dunsworth, A

Reference 31

Resolution: unresolved; no resolver link, observed 2026-08-10T10:46:14.205678Z

Source-reported events for the cited work

Unavailable: canonical work link unavailable.

Observation 202e2e04-8aaf-43c2-afd8-0dfbb07b608b · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 32

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.711437Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation f6d56381-a652-4d7d-a910-117a56499bd4 · outbound

This paper cites Müller, J.

Flip-chip integrated superconducting qubits using electroplated bump bonds Müller, J

Reference 33

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.698584Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation e28b92da-0248-47be-870a-127b1c0c9848 · outbound

This paper cites Wenner, R.

Flip-chip integrated superconducting qubits using electroplated bump bonds Wenner, R

Reference 34

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.685331Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 602f210f-d929-4f14-9446-a0a9efdc4eba · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 35

Resolution: unresolved; no resolver link, observed 2026-08-10T10:46:14.221588Z

Source-reported events for the cited work

Unavailable: canonical work link unavailable.

Observation 8780a0d6-d7af-4be9-b309-79946900e3f1 · outbound

This paper cites Barends, N.

Flip-chip integrated superconducting qubits using electroplated bump bonds Barends, N

Reference 36

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.663846Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 07469a05-5bfa-4d14-b795-7d0d0c764d1c · outbound

This paper cites Kroll, F.

Flip-chip integrated superconducting qubits using electroplated bump bonds Kroll, F

Reference 37

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.649769Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 547108c8-a09e-4471-acdc-91a7249fcea6 · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 38

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.636994Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation fdf80d68-c614-46ce-8fa3-5c744e9cfc1a · outbound

This paper cites Pita-Vidal, J.

Flip-chip integrated superconducting qubits using electroplated bump bonds Pita-Vidal, J

Reference 39

Resolution: verified fuzzy; raw_fallback, observed 2026-08-10T10:46:14.623825Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 9979513b-f453-4199-adad-2216a3412124 · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 40

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.610433Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 7bd2d6c3-be00-4417-8ebe-4a16154bfbe0 · outbound

This paper cites an unresolved cited work.

Flip-chip integrated superconducting qubits using electroplated bump bonds Unresolved cited work

Reference 41

Resolution: unresolved; raw_fallback, observed 2026-08-10T10:46:14.597295Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Observation 0c439c47-af4a-4c54-886b-daaea4f8c830 · outbound

This paper cites Singh, E.

Flip-chip integrated superconducting qubits using electroplated bump bonds Singh, E

Reference 42

Resolution: unresolved; no resolver link, observed 2026-08-10T10:46:14.249353Z

Source-reported events for the cited work

Unavailable: canonical work link unavailable.

Observation d584fe95-5ca1-4868-962f-462129ea5c55 · outbound

This paper cites Flip-chip integrated superconducting qubits using electroplated bump bonds.

Flip-chip integrated superconducting qubits using electroplated bump bonds Flip-chip integrated superconducting qubits using electroplated bump bonds

Reference 106

Resolution: malformed identifier; local_arxiv, observed 2026-08-10T10:46:14.575541Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.

Pith citing papers

Observation d584fe95-5ca1-4868-962f-462129ea5c55 · inbound