REVIEW 5 minor 1 cited by
State of the Art on Stacked Intelligent Metasurfaces: Communication, Sensing and Computing in the Wave Domain
T0 review · 0 major / 5 minor · reviewed 2026-08-12 · deepseek-v4-flash
Pith's one-line read This survey argues that stacked intelligent metasurfaces can integrate communication, sensing, and computing in the wave domain, cutting the power cost of digital processing.
desk verdict A three-page annotated bibliography on SIM that is honest about the field's open problems but adds no critical synthesis or quantitative context; useful as a pointer, not as a definitive reference. read the letter →
The pith
A machine-rendered reading of the paper's core claim, the machinery that carries it, and where it could break.
The reading
What carries the argument
The central object is the stacked intelligent metasurface (SIM): a stack of reconfigurable metasurface layers through which a signal propagates, each layer applying a tunable phase (and sometimes amplitude) profile, and the layers together implementing a mathematical operation on the incident wave field. The computational model that carries most cited results treats each layer by unit-amplitude transmission coefficients and models inter-layer propagation with scalar Rayleigh-Sommerfeld diffraction theory, which lets the whole stack be optimized as a differentiable neural network. This model is what turns the physical stack into a programmable wave-domain computer, and the survey flags that it is also the least tested part of the technology.
What would settle it
A direct comparison of a fabricated SIM against its scalar-diffraction simulation: measure the transmitted amplitude and phase between adjacent layers, or the end-to-end beamforming gain, and check agreement with the Rayleigh-Sommerfeld prediction; a systematic divergence as layer spacing shrinks would falsify the model on which most current SIM claims are built.
Extended reading notes
Core claim
The discovery the survey documents is that a cascade of nearly-passive reconfigurable metasurfaces can act as a programmable analog processor for radio waves, and that this processor can be configured to perform beamforming, Fourier transforms for direction-of-arrival estimation, joint communication and sensing, and even semantic encoding and decoding, all in the wave domain. The paper asserts the main advantage of SIM over fully digital implementations is reduced power consumption and complexity, since wave-domain processing bypasses the energy cost of analog-to-digital converters, which grows exponentially with resolution and linearly with bandwidth. On the evidence surveyed, most results are simulation-based, with a single recent experimental demonstration using one-bit dynamic metasurfaces for multi-user integrated sensing and communication.
Load-bearing premise
The reported gains assume each metasurface layer transmits with unit amplitude and that propagation between layers is accurately described by scalar Rayleigh-Sommerfeld diffraction; if real inter-layer coupling and losses violate this model, the simulated beamforming and sensing gains may shrink or vanish.
Editorial extensions
If this is right
- If SIM's wave-domain computing works as modeled, base stations and user terminals could replace part of their digital baseband processing with a nearly passive analog front end, cutting power consumption in proportion to how much processing moves into the wave domain.
- Integrated sensing and communication could be offered by the same aperture, with the same layers that form communication beams also performing direction-of-arrival estimation or other tasks, potentially cheaply multiplexed in time or frequency.
- Semantic communication systems could move their encoder and decoder into the analog domain, reducing the digital overhead of compressing and transmitting task-relevant information.
- Since the beamforming literature is already large, the near-term path is not algorithmic but physical: accurate electromagnetic models and full-wave simulations will decide whether simulated gains survive in hardware.
Reading between the lines
- The performance gap between the scalar diffraction model and full-wave physics may be largest when layers are closely spaced relative to wavelength; a systematic comparison of Rayleigh-Sommerfeld against full-wave solvers as a function of inter-layer distance would delineate where SIM claims hold.
- The same stacking principle could be transferred to other frequency bands such as terahertz or optical, where digital processing is even more costly, making the survey's taxonomy relevant beyond wireless communications.
- A testable extension is to use the SIM itself to perform channel estimation by configuring the stack to compute a compressed sensing measurement of the channel, rather than estimating the channel digitally and then configuring the beamformer.
Signed reviews
Editorial analysis
A structured set of objections, weighed in public.
Referee Report
Summary. This paper is a short survey of stacked intelligent metasurfaces (SIMs) for wireless communications. It organizes roughly forty recent works into six application areas—beamforming, channel estimation, direction-of-arrival estimation, integrated sensing and communications, semantic communications, and electromagnetic modeling—plus a section on experimental work. The abstract and introduction present SIM as an emerging technology capable of integrating communication, sensing, and computing in the wave domain, with the advertised advantage of lower power consumption and complexity than fully digital neural-network processing. The survey classifies the literature, reports high-level findings from selected papers, and concludes by identifying electromagnetic modeling and hardware validation as open research directions.
Significance. The paper provides a useful, citable entry point to a genuinely fast-moving literature, and it is honest about the immaturity of the field: it explicitly states that most results use an ideal unit-amplitude/scalar-Rayleigh-Sommerfeld model (Section II-F) and that only preliminary one-bit experiments exist in wireless (Section II-G). Its contribution is taxonomic rather than technical—there are no derivations, simulations, or tables of quantitative comparisons. If the aim of the venue is to publish concise field snapshots, the paper serves its purpose; its value would be increased by a short comparative table and by more explicit qualifications of the performance claims in the introduction, but these do not undermine the factual organization of the surveyed literature. In particular, the stress-test concern about an unvalidated electromagnetic model is already acknowledged in the manuscript as an open issue; it is a limitation of the surveyed literature rather than an internal inconsistency of this survey.
minor comments (5)
- [Section I] The statement that 'the main advantage of SIM is to reduce the power consumption and complexity of digital artificial neural networks' would benefit from a qualifier such as 'in simulation studies based on lossless metasurface models,' since the cited [10] and related works assume unit-amplitude transmission (Section II-F).
- [Section II-B] The paragraph on channel estimation states that estimation is 'more similar to conventional multiple-antenna systems' when the SIM is part of the transmitter, but it does not explain what is compared (pilot overhead, training loss, complexity) or cite a specific result from [34]–[36]; please clarify.
- [Sections II-F and II-G] The survey would be stronger if it summarized, in a sentence or two, whether the preliminary one-bit experiments in [41] are consistent with the unit-amplitude/scalar-diffraction model or whether they indicate that the ideal model is optimistic; this would help readers gauge the maturity of the field.
- [Section III] The conclusion mentions 'several open research issues' but does not enumerate them; a brief bulleted list of the open problems identified in Sections II-F and II-G would make the contribution more actionable.
- [Throughout] There are minor language and formatting issues: in Section II-B, 'is SIM-aided systems' should read 'in SIM-aided systems'; in Section II-C, 'bi-dimensional' is more commonly written 'two-dimensional'; and reference [46] should include an access date if the journal style requires one.
Circularity Check
Survey contains no derivation chain, fitted-input predictions, or self-citation-reduced claims, so no circularity is present.
full rationale
This is a survey paper, not a derivation or prediction paper. It classifies existing SIM literature and reports the state of the art, so the circularity patterns defined for derived results do not apply: there are no fitted parameters renamed as predictions, no predictive equations equivalent to their inputs by construction, and no uniqueness theorem imported to force a choice. The closest thing to a load-bearing premise is the electromagnetic modeling discussion in Section II-F, where the paper states that most works use unit-amplitude transmission coefficients and scalar Rayleigh-Sommerfeld diffraction theory. That is an acknowledged modeling assumption, and the paper explicitly notes that multiport network theory is a more accurate approach and that experiments are still preliminary in Section II-G. Acknowledging an open limitation is not circular reasoning. The survey does cite many works involving the author, but these citations are bibliographic support for the existence and growth of a research area rather than a derivation step that reduces to a self-citation; no central claim is justified solely by an unverified self-citation chain. Therefore the appropriate finding is no significant circularity.
Assumptions & free parameters
assumptions (3)
- domain assumption A stack of reconfigurable metasurface layers can be modeled as a feed-forward artificial neural network operating in the electromagnetic domain.
- domain assumption Each SIM layer has unit-amplitude transmission coefficients and inter-layer propagation follows scalar Rayleigh-Sommerfeld diffraction.
- domain assumption The power consumption of analog-to-digital converters grows exponentially with number of bits and linearly with bandwidth, which motivates analog or wave-domain processing.
Cite this review
Pith. "Pith review of State of the Art on Stacked Intelligent Metasurfaces: Communication, Sensing and Computing in the Wave Domain." pith.science (2026). https://pith.science/paper/MBLNA5IU
@misc{pith2026241119687,
author = {Pith},
title = {Pith review of: State of the Art on Stacked Intelligent Metasurfaces: Communication, Sensing and Computing in the Wave Domain},
year = {2026},
howpublished = {\url{https://pith.science/paper/MBLNA5IU}},
note = {Machine review of arXiv:2411.19687}
}
read the original abstract
Stacked intelligent metasurface (SIM) is an emerging technology that capitalizes on reconfigurable metasurfaces for several applications in wireless communications. SIM is considered an enabler for integrating communication, sensing and computing in a unique platform. In this paper, we offer a survey on the state of the art of SIM for wireless communications.
Forward citations
Cited by 1 Pith paper
-
Max-Min Fairness for Stacked Intelligent Metasurface-Assisted Multi-User MISO Systems
Two max-min fairness algorithms, built from geometric programming and gradient descent/ascent, are proposed for SIM-assisted multi-user MISO downlinks, with a statistical-CSI upper bound that is tight at low SNR.
Reference graph
Works this paper leans on
-
[1]
Smart radio environments emp owered by reconfigurable intelligent surfaces: How it works, state of research, and the road ahead,
M. Di Renzo, A. Zappone, M. Debbah, M.-S. Alouini, C. Y uen , J. de Rosny, and S. Tretyakov, “Smart radio environments emp owered by reconfigurable intelligent surfaces: How it works, state of research, and the road ahead,” IEEE Journal on Selected Areas in Communications , vol. 38, no. 11, pp. 2450–2525, 2020
2020
-
[2]
Intellige nt reflecting surface-aided wireless communications: A tutorial,
Q. Wu, S. Zhang, B. Zheng, C. Y ou, and R. Zhang, “Intellige nt reflecting surface-aided wireless communications: A tutorial,” IEEE Transactions on Communications , vol. 69, no. 5, pp. 3313–3351, 2021
2021
-
[3]
Communica tion mod- els for reconfigurable intelligent surfaces: From surface e lectromagnetics to wireless networks optimization,
M. Di Renzo, F. H. Danufane, and S. Tretyakov, “Communica tion mod- els for reconfigurable intelligent surfaces: From surface e lectromagnetics to wireless networks optimization,” Proceedings of the IEEE , vol. 110, no. 9, pp. 1164–1209, 2022
2022
-
[4]
Intelligent surfaces empowered wireless network: Recent advances and the road to 6G,
Q. Wu, B. Zheng, C. Y ou, L. Zhu, K. Shen, X. Shao, W. Mei, B. D i, H. Zhang, E. Basar, L. Song, M. Di Renzo, Z.-Q. Luo, and R. Zhan g, “Intelligent surfaces empowered wireless network: Recent advances and the road to 6G,” Proceedings of the IEEE , pp. 1–40, 2024
work page 2024
-
[5]
Next generation advanced transceiver technologies for 6G,
C. Y ou, Y . Cai, Y . Liu, M. Di Renzo, T. M. Duman, A. Y ener, an d A. L. Swindlehurst, “Next generation advanced transceiver technologies for 6G,” CoRR, vol. abs/2403.16458, 2024. [Online]. Available: https://doi.org/10.48550/arXiv.2403.16458
-
[6]
A prototype of reconfigurable intelligent surf ace with con- tinuous control of the reflection phase,
R. Fara, P . Ratajczak, D.-T. Phan-Huy, A. Ourir, M. Di Ren zo, and J. de Rosny, “A prototype of reconfigurable intelligent surf ace with con- tinuous control of the reflection phase,” IEEE Wireless Communications, vol. 29, no. 1, pp. 70–77, 2022
work page 2022
-
[7]
J. Xu, C. Y uen, C. Huang, N. Ul-Hassan, G. Alexandropoulo s, M. Di Renzo, and D. M´ erouane, “Reconfiguring wireless envir onments via intelligent surfaces for 6G: Reflection, modulation, an d security,” Science China Information Sciences , vol. 66, no. 3, pp. 130 304–, 2023
work page 2023
-
[8]
Y .-C. Liang, J. Chen, R. Long, Z.-Q. He, X. Lin, C. Huang, S . Liu, X. Shen, and M. Di Renzo, “Reconfigurable intelligent surfac es for smart wireless environments: Channel estimation, system d esign and applications in 6G networks,” Science China Information Sciences , vol. 64, p. 200301, 10 2021
work page 2021
Show all 48 references
-
[9]
The race for the extra decibel: A brief revie w of current ADC performance trajectories,
B. Murmann, “The race for the extra decibel: A brief revie w of current ADC performance trajectories,” IEEE Solid-State Circuits Magazine , vol. 7, no. 3, pp. 58–66, 2015
2015
-
[10]
Stacked intelligent metasurface-aided MIMO transceiver design,
J. An, C. Y uen, C. Xu, H. Li, D. W. K. Ng, M. Di Renzo, M. Debb ah, and L. Hanzo, “Stacked intelligent metasurface-aided MIMO transceiver design,” IEEE Wireless Communications , vol. 31, no. 4, pp. 123–131, 2024
2024
-
[11]
All-optical machine learning using diffractive deep neural networks,
X. Lin, Y . Rivenson, N. T. Y ardimci, M. V eli, Y . Luo, M. Ja rrahi, and A. Ozcan, “All-optical machine learning using diffractive deep neural networks,” Science, vol. 361, no. 6406, pp. 1004–1008, 2018. [Online]. Available: https://www.science.org/doi/abs/10.1126/science.aat8084
2018 doi
-
[12]
A programmable diffractive d eep neural network based on a digital-coding metasurface array ,
C. Liu, Q. Ma, Z. Luo, Q. Hong, Q. Xiao, H. Zhang, L. Miao, W .-M. Y u, Q. Cheng, L. Li, and T. Cui, “A programmable diffractive d eep neural network based on a digital-coding metasurface array ,” Nature Electronics, vol. 5, pp. 1–10, 02 2022
2022
-
[13]
Dif fractive deep neural networks: Theories, optimization, and applica tions,
H. Chen, S. Lou, Q. Wang, P . Huang, H. Duan, and Y . Hu, “Dif fractive deep neural networks: Theories, optimization, and applica tions,” Applied Physics Reviews , vol. 11, no. 2, p. 021332, 06 2024. [Online]. Available: https://doi.org/10.1063/5.0191977
2024 doi
-
[14]
Exploring the role of metamater ials in achiev- ing advantage in optical computing,
Y . Li and F. Monticone, “Exploring the role of metamater ials in achiev- ing advantage in optical computing,” Nature Computational Science , vol. 4, pp. 545–548, 08 2024
2024
-
[15]
Stacked intelligent metasurfaces for efficie nt holographic MIMO communications in 6G,
J. An, C. Xu, D. W. K. Ng, G. C. Alexandropoulos, C. Huang, C. Y uen, and L. Hanzo, “Stacked intelligent metasurfaces for efficie nt holographic MIMO communications in 6G,” IEEE Journal on Selected Areas in Communications, vol. 41, no. 8, pp. 2380–2396, 2023
2023
-
[16]
Stacked intel ligent metasurfaces for multiuser beamforming in the wave domain,
J. An, M. Di Renzo, M. Debbah, and C. Y uen, “Stacked intel ligent metasurfaces for multiuser beamforming in the wave domain, ” in ICC 2023 - IEEE International Conference on Communications , 2023, pp. 2834–2839
2023
-
[17]
E fficient beamforming and radiation pattern control using stacked in telligent metasurfaces,
N. U. Hassan, J. An, M. Di Renzo, M. Debbah, and C. Y uen, “E fficient beamforming and radiation pattern control using stacked in telligent metasurfaces,” IEEE Open Journal of the Communications Society , vol. 5, pp. 599–611, 2024
2024
-
[18]
Achievable rate optimization for stacked intelligent metasurface-assisted holographic MIMO communications,
A. Papazafeiropoulos, J. An, P . Kourtessis, T. Ratnara jah, and S. Chatzinotas, “Achievable rate optimization for stacked intelligent metasurface-assisted holographic MIMO communications,” IEEE Trans- actions on Wireless Communications, vol. 23, no. 10, pp. 13 173–13 186, 2024
2024
-
[19]
Stacked intelligent metasurface enabled near-field multi user beamfo- cusing in the wave domain,
X. Jia, J. An, H. Liu, L. Gan, M. Di Renzo, M. Debbah, and C. Y uen, “Stacked intelligent metasurface enabled near-field multi user beamfo- cusing in the wave domain,” in 2024 IEEE 99th V ehicular Technology Conference (VTC2024-Spring), 2024, pp. 1–5
2024
-
[20]
Mutual information optimiza tion for SIM-based holographic MIMO systems,
N. S. Perovic and L. Tran, “Mutual information optimiza tion for SIM-based holographic MIMO systems,” CoRR, vol. abs/2403.18307,
-
[21]
Stacked intelligent metasurf aces for fully- analog wideband beamforming design,
Z. Li, J. An, and C. Y uen, “Stacked intelligent metasurf aces for fully- analog wideband beamforming design,” in 2024 IEEE VTS Asia Pacific Wireless Communications Symposium (APWCS) , 2024, pp. 1–5
2024
-
[22]
Design of stacked intelligent metasurfaces with reconfigurable amplitude an d phase for multiuser downlink beamforming,
D. Darsena, F. V erde, I. Iudice, and V . Galdi, “Design of stacked intelligent metasurfaces with reconfigurable amplitude an d phase for multiuser downlink beamforming,” 2024. [Online]. Avai lable: https://arxiv.org/abs/2408.16606
2024 arXiv
-
[23]
Stacked int elligent metasurface enabled LEO satellite communications relying on statistical CSI,
S. Lin, J. An, L. Gan, M. Debbah, and C. Y uen, “Stacked int elligent metasurface enabled LEO satellite communications relying on statistical CSI,” IEEE Wireless Communications Letters , vol. 13, no. 5, pp. 1295– 1299, 2024
2024
-
[24]
Performance of double-stacked intelligent metasurface- assisted multiuser massive MIMO communications in the wave domain,
A. K. Papazafeiropoulos, P . Kourtessis, and S. Chatzin otas, “Performance of double-stacked intelligent metasurface- assisted multiuser massive MIMO communications in the wave domain,” CoRR, vol. abs/2402.16405, 2024. [Online]. Available: https://doi.org/10.48550/arXiv.2402.16405
-
[25]
Uplink wave-domain combiner for stacked intelligent meta surfaces accounting for hardware limitations,
M. Rezvani, R. Adve, A. bin Sediq, and A. El-Keyi, “Uplink wave-domain combiner for stacked intelligent meta surfaces accounting for hardware limitations,” 2024. [Online]. Ava ilable: https://arxiv.org/abs/2407.21012
2024 arXiv
-
[26]
Multi-user MISO with stacked intelligent metasurfaces: A DRL-based sum-rate optimization approach,
H. Liu, J. An, G. C. Alexandropoulos, D. W. K. Ng, C. Y uen, and L. Gan, “Multi-user MISO with stacked intelligent metasurfaces: A DRL-based sum-rate optimization approach,” CoRR, vol. abs/2408.04837, 2024. [Online]. Available: https://doi.org/10.48550/arXiv.2408.04837
-
[27]
DRL-based orchestration of multi-user MISO systems with s tacked intelligent metasurfaces,
H. Liu, J. An, D. W. K. Ng, G. C. Alexandropoulos, and L. Ga n, “DRL-based orchestration of multi-user MISO systems with s tacked intelligent metasurfaces,” in ICC 2024 - IEEE International Conference on Communications, 2024, pp. 4991–4996
2024
-
[28]
Joint SIM configuration and power allocation for stacked in telligent metasurface-assisted MU-MISO systems with TD3,
X. Y ang, J. Zhang, E. Shi, Z. Liu, J. Liu, K. Zheng, and B. A i, “Joint SIM configuration and power allocation for stacked in telligent metasurface-assisted MU-MISO systems with TD3,” 2024. [On line]. Available: https://arxiv.org/abs/2408.05756
2024
-
[29]
S tacked in- telligent metasurfaces for holographic MIMO aided cell-fr ee networks,
Q. Li, M. El-Hajjar, C. Xu, J. An, C. Y uen, and L. Hanzo, “S tacked in- telligent metasurfaces for holographic MIMO aided cell-fr ee networks,” IEEE Transactions on Communications , pp. 1–1, 2024
2024
-
[30]
Up- link performance and beamforming design of SIM-enhanced ce ll-free massive MIMO systems,
E. Shi, J. Zhang, Y . Zhu, Z. Liu, J. An, C. Y uen, and B. Ai, “ Up- link performance and beamforming design of SIM-enhanced ce ll-free massive MIMO systems,” in 2024 IEEE VTS Asia Pacific Wireless Communications Symposium (APWCS) , 2024, pp. 01–05
2024
-
[31]
Energy-effi cient designs for SIM-based broadcast MIMO systems,
N. S. Perovic, E. E. Bahingayi, and L. Tran, “Energy-effi cient designs for SIM-based broadcast MIMO systems,” CoRR, vol. abs/2409.00628,
-
[32]
Enhancing physical layer security for SISO systems using stacked intelligent m etasurfaces,
H. Niuab, J. An, L. Zhang, X. Lei, and C. Y uen, “Enhancing physical layer security for SISO systems using stacked intelligent m etasurfaces,” in 2024 IEEE VTS Asia Pacific Wireless Communications Symposiu m (APWCS), 2024, pp. 1–5
2024
-
[33]
Available: https://doi.org/10.48550/ar Xiv.2409.00628
[Online]. Available: https://doi.org/10.48550/ar Xiv.2409.00628
-
[34]
Channel es timation for stacked intelligent metasurface-assisted wireless ne tworks,
X. Y ao, J. An, L. Gan, M. Di Renzo, and C. Y uen, “Channel es timation for stacked intelligent metasurface-assisted wireless ne tworks,” IEEE Wireless Communications Letters , vol. 13, no. 5, pp. 1349–1353, 2024
2024
-
[35]
An overview o f signal processing techniques for RIS/IRS-aided wireless s ystems,
C. Pan, G. Zhou, K. Zhi, S. Hong, T. Wu, Y . Pan, H. Ren, M. Di Renzo, A. Lee Swindlehurst, R. Zhang, and A. Y . Zhang, “An overview o f signal processing techniques for RIS/IRS-aided wireless s ystems,” IEEE Journal of Selected Topics in Signal Processing , vol. 16, no. 5, pp...
2022
-
[36]
Hybrid digital-wave d omain channel estimator for stacked intelligent metasurface ena bled multi- user MISO systems,
Q. Nadeem, J. An, and A. Chaaban, “Hybrid digital-wave d omain channel estimator for stacked intelligent metasurface ena bled multi- user MISO systems,” in IEEE Wireless Communications and Networking Conference, WCNC 2024, Dubai, United Arab Emira tes, April 21-24, 2024 . IEEE...
2024
-
[37]
Spars e channel estimation for stacked intelligent metasurface-assisted mmWave com- munications,
X. Y ao, J. An, G. Huang, H. Liu, L. Gan, and C. Y uen, “Spars e channel estimation for stacked intelligent metasurface-assisted mmWave com- munications,” in 2024 IEEE VTS Asia Pacific Wireless Communications Symposium (APWCS) , 2024, pp. 1–5
2024
-
[38]
Stacked intelligent metasurface performs a 2D DFT in the wave domain for DOA estimation,
——, “Stacked intelligent metasurface performs a 2D DFT in the wave domain for DOA estimation,” in ICC 2024 - IEEE International Conference on Communications , 2024, pp. 3445–3451
2024
-
[39]
Two-dimensional direction-of-arrival esti mation using stacked intelligent metasurfaces,
J. An, C. Y uen, Y . L. Guan, M. Di Renzo, M. Debbah, H. V . Poo r, and L. Hanzo, “Two-dimensional direction-of-arrival esti mation using stacked intelligent metasurfaces,” IEEE Journal on Selected Areas in Communications, vol. 42, no. 10, pp. 2786–2802, 2024
2024
-
[40]
Stacked intelligent metasurfaces for integrat ed sensing and communications,
H. Niu, J. An, A. Papazafeiropoulos, L. Gan, S. Chatzino tas, and M. Debbah, “Stacked intelligent metasurfaces for integrat ed sensing and communications,” IEEE Wireless Communications Letters , vol. 13, no. 10, pp. 2807–2811, 2024
2024
-
[41]
Stacked intelligent metasurfaces for wireless sensing and communication: Appl ications and challenges,
H. Liu, J. An, X. Jia, S. Lin, X. Y ao, L. Gan, B. Clerckx, C. Y uen, M. Bennis, and M. Debbah, “Stacked intelligent metasurfaces for wireless sensing and communication: Appl ications and challenges,” CoRR, vol. abs/2407.03566, 2024. [Online]. Available: https://doi.org/10.485...
-
[42]
Transmit beamforming design for ISAC with stacked intelligent metasurfaces,
S. Li, F. Zhang, T. Mao, R. Na, Z. Wang, and G. K. Karagiannidis, “Transmit beamforming design for ISAC with stacked intelligent metasurfaces,” 2024. [Online]. Avail able: https://arxiv.org/abs/2409.03259
2024 arXiv
-
[43]
Multi-user ISAC through stacked intelligent met asurfaces: New algorithms and experiments,
Z. Wang, H. Liu, J. Zhang, R. Xiong, K. Wan, X. Qian, M. Di R enzo, and R. C. Qiu, “Multi-user ISAC through stacked intelligent met asurfaces: New algorithms and experiments,” CoRR, vol. abs/2405.01104, 2024. [Online]. Available: https://doi.org/10.48550/arXiv.2405.01104
-
[44]
A u niversal framework for multiport network analysis of reconfigurable intelligent surfaces,
M. Nerini, S. Shen, H. Li, M. Di Renzo, and B. Clerckx, “A u niversal framework for multiport network analysis of reconfigurable intelligent surfaces,” IEEE Transactions on Wireless Communications , vol. 23, no. 10, pp. 14 575–14 590, 2024
2024
-
[45]
Stacked intelligent metasurfaces for task-ori ented semantic communications,
G. Huang, J. An, Z. Y ang, L. Gan, M. Bennis, and M. Debbah, “Stacked intelligent metasurfaces for task-ori ented semantic communications,” CoRR, vol. abs/2407.15053, 2024. [Online]. Available: https://doi.org/10.48550/arXiv.2407.15053
-
[46]
Online webinar - stacked intelligent surf aces,
M. Di Renzo, “Online webinar - stacked intelligent surf aces,” https://youtu.be/dS0d5hxn2K0?t=102, May 2024
2024
-
[47]
Physically consistent model ing of stacked intelligent metasurfaces implemented with beyond diagona l RIS,
M. Nerini and B. Clerckx, “Physically consistent model ing of stacked intelligent metasurfaces implemented with beyond diagona l RIS,” IEEE Communications Letters , vol. 28, no. 7, pp. 1693–1697, 2024
2024
- [2024]
Reviewed August 12, 2026 · model on record in the stance chip above.
Discussion (0). Continue with ORCID to comment.