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Impact of thermal annealing on graphene devices encapsulated in hexagonal boron nitride

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arxiv 1805.01749 v1 pith:SUQVZVRG submitted 2018-05-04 cond-mat.mes-hall

Impact of thermal annealing on graphene devices encapsulated in hexagonal boron nitride

classification cond-mat.mes-hall
keywords annealingdopingstrainboronencapsulatedgraphenehexagonalnitride
verification ladder T0 review T1 audit T2 compute T3 formal T4 reserved
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We present a thermal annealing study on single-layer and bilayer (BLG) graphene encapsulated in hexagonal boron nitride. The samples are characterized by electron transport and Raman spectroscopy measurements before and after each annealing step. While extracted material properties such as charge carrier mobility, overall doping, and strain are not influenced by the annealing, an initial annealing step lowers doping and strain variations and thus results in a more homogeneous sample. Additionally, the narrow 2D-sub-peak widths of the Raman spectrum of BLG, allow us to extract information about strain and doping values from the correlation of the 2D-peak and the G-peak positions.

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