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arxiv 2502.21225 v1 pith:T3KVKE4M submitted 2025-02-28 cond-mat.str-el cond-mat.mtrl-sci

Large Seebeck coefficient driven by "pudding mold" flat band in hole-doped CuRhO₂

classification cond-mat.str-el cond-mat.mtrl-sci
keywords bandflatmaterialstructurethermoelectriccoefficientcurhoexperimental
verification ladder T0 review T1 audit T2 compute T3 formal T4 reserved
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We report the measurement, using angle-resolved photoemission spectroscopy, of the metallic electronic structure of the hole-doped thermoelectric oxide CuRh$_{0.9}$Mg$_{0.1}$O$_2$. The material is found to have a ``pudding mold'' type band structure, with a nearly flat band edge located near the Fermi level, which is thought to be the origin of the thermoelectric behavior of this material. The experimental data match the density functional theory of the undoped parent compound, simply corrected by a rigid shift of the bands. Transport calculations based on the observed band structure yield a Seebeck coefficient of $\sim 200 \,\mu$V/K for the undoped parent material, consistent with experimental measurements. Our results show that CuRhO$_2$ is a textbook example of how pure band-structural effects can result in a large thermoelectric figure of merit, demonstrating that flat band edges in oxides are a realistic route for the efficient conversion of thermal energy.

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