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arxiv: 2605.18492 · v1 · pith:TQXVCRRJnew · submitted 2026-05-18 · ⚛️ physics.comp-ph · physics.app-ph· physics.class-ph

Simulation of S-parameters of general multilayer boxed PCBs with the method of moments and the scattering matrix algorithm

Pith reviewed 2026-05-20 01:44 UTC · model grok-4.3

classification ⚛️ physics.comp-ph physics.app-phphysics.class-ph
keywords printed circuit boardmethod of momentsscattering matrixGreen's functionS-parametersmultilayer structureselectromagnetic modelingshielded media
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The pith

A scattering matrix approach derives the full dyadic Green's function for 2.5D simulation of multilayer PCBs.

A machine-rendered reading of the paper's core claim, the machinery that carries it, and where it could break.

The paper presents a method to simulate S-parameters of general multilayer boxed printed circuit boards using the method of moments combined with the scattering matrix algorithm. It derives an analytic expression for the complete dyadic Green's function in a layered waveguide by expressing it through three sets of S-matrices linked to the source and observation layers. This provides a numerically stable way to handle both transverse and longitudinal currents in thin conductive components. The approach includes overlap integrals for rooftop, pulse, and linear basis functions to model planar layers and vertical interconnects. Numerical examples validate the method for shielded PCB geometries.

Core claim

The Green's function in a layered waveguide is calculated in a straightforward manner using the S-matrix formalism, resulting in an expression involving three sets of S-matrices associated with the PCB layers containing the current source and the field observation point. This enables the 2.5D MoM solution for integral equations in general multilayer boxed PCB structures that include both transverse and longitudinal currents.

What carries the argument

Three sets of S-matrices for the layers of the electric current source and the electric field observation point, used to compute the complete dyadic Green's function in a layered waveguide.

If this is right

  • The method supports modeling of planar metallization layers with surface rooftop basis functions and vertical interconnects with volume pulse and linear basis functions.
  • Overlap integrals are provided for these basis functions to facilitate implementation.
  • The approach maintains numerical stability inherent to the S-matrix method while allowing intuitive calculation of the Green's function.
  • It can be extended to other basis functions for simulating objects of various shapes in PCB designs.

Where Pith is reading between the lines

These are editorial extensions of the paper, not claims the author makes directly.

  • This could lead to faster design iterations in PCB manufacturing by allowing pre-manufacturing optimization through accurate simulations.
  • Similar S-matrix techniques might apply to other layered electromagnetic problems beyond PCBs, such as integrated circuits or antennas in enclosures.
  • Further development could incorporate more complex material properties or non-uniform layers to broaden applicability.

Load-bearing premise

The PCB geometry can be modeled as thin highly conductive components enclosed in a simply shaped dielectric host that fits the layered waveguide approximation.

What would settle it

If measurements on a physical multilayer PCB with vias show significant deviation from the simulated S-parameters, particularly for structures involving longitudinal currents, the validity of the Green's function derivation would be questioned.

Figures

Figures reproduced from arXiv: 2605.18492 by A. A. Shcherbakov, A. O. Makarenko, P. Zheglova, R. Gaponenko, R. I. Tikhonov, R. V. Salimov.

Figure 1
Figure 1. Figure 1: An example PCB structure. While neither this problem nor our general approach are new, the contribution of our work lies in an alternative solution method characterized by transparency, conciseness, elegance, generality and numerical stability. The paper is organized as follows. In section II, EFIE formulation of the problem is given. In section III, we show the derivation of the multilayer Green’s functio… view at source ↗
Figure 4
Figure 4. Figure 4: S A and S B matrices associated with layers [PITH_FULL_IMAGE:figures/full_fig_p008_4.png] view at source ↗
Figure 2
Figure 2. Figure 2: S-matrices associated with layers l and l ′ , when zv and zs are in different layers: (a) zv > zs; (b) zv < zs [PITH_FULL_IMAGE:figures/full_fig_p008_2.png] view at source ↗
Figure 3
Figure 3. Figure 3: S-matrices associated with layer l, when zv and zs are in the same layer: (a) zv ≥ zs; (b) zv ≤ zs. To compute the three introduced sets of matrices, S A l , S B l , and S P ll′ we assume a waveguide to have (L + 1) layers, L inner interfaces between different media, supported with the top and bottom boundary conditions defined in Eq. (17). As an example, Figs. 4 and 5 show a structure with L = 8 interface… view at source ↗
Figure 7
Figure 7. Figure 7: Filter with three layers and six metal strips: frequency dependence of [PITH_FULL_IMAGE:figures/full_fig_p013_7.png] view at source ↗
Figure 6
Figure 6. Figure 6: Filter with three layers and six metal strips: model geometry, [PITH_FULL_IMAGE:figures/full_fig_p013_6.png] view at source ↗
Figure 8
Figure 8. Figure 8: Filter with three layers and six metal strips [PITH_FULL_IMAGE:figures/full_fig_p014_8.png] view at source ↗
Figure 9
Figure 9. Figure 9: Filter with three layers, six metal strips and two interconnect sections: [PITH_FULL_IMAGE:figures/full_fig_p014_9.png] view at source ↗
read the original abstract

Printed circuit board (PCB) modelling is an important part of the PCB production process, in which the designer aims to optimize the desired output characteristics prior to physical PCB manufacturing. Due to the specific shape of PCBs, namely, thin and highly conductive components enclosed within a relatively simply shaped dielectric host, the PCB modelling problem is amenable to solution by the so-called 2.5D Method of Moments (MoM) applied to the integral equation solution of Maxwell's equations. For this purpose, an analytic expression for the Green's function of the host medium needs to be derived. Many studies exist in which expressions are derived for the transverse Green's function components in a waveguide, used for modelling planar metallization layers in shielded layered media. Works containing the full Green's function that allows modelling of both longitudinal and transverse currents are much fewer. In this study, we propose a tool to solve the shielded PCB modelling problem involving both transverse and longitudinal currents, with the Green's function in a layered waveguide derived using the S-matrix formalism. Our approach combines a straightforward, intuitive way of calculating the complete dyadic Green's function in a layered waveguide with the inherent numerical stability of the S-matrix method. The Green's function is expressed in terms of three sets of S-matrices associated with the PCB layers in which the electric current source and the electric field observation point are located. The MoM is implemented using surface rooftop, volume pulse, and linear basis functions, for which we provide the overlap integrals, to model planar metallization layers and wire-like vertical interconnects. The validity of the method is demonstrated on two numerical examples. The method can be extended to other bases to model objects of various shapes.

Editorial analysis

A structured set of objections, weighed in public.

Desk editor's note, referee report, simulated authors' rebuttal, and a circularity audit. Tearing a paper down is the easy half of reading it; the pith above is the substance, this is the friction.

Referee Report

1 major / 1 minor

Summary. The manuscript develops a 2.5D Method of Moments formulation for computing S-parameters of general multilayer boxed PCBs. The central contribution is an analytic construction of the complete dyadic Green's function for a layered waveguide obtained via the scattering-matrix algorithm; the Green's function is expressed using three sets of S-matrices associated with the layers containing the electric-current source and the field observation point. The formulation accommodates both transverse and longitudinal currents through surface rooftop, volume pulse, and linear basis functions, for which explicit overlap integrals are supplied. Validity is illustrated by two numerical examples.

Significance. If the derivation and demonstrations hold, the work supplies a numerically stable route to the full dyadic Green's function in shielded layered media, directly addressing the modeling of both planar metallization and vertical interconnects inside rectangular enclosures. The S-matrix construction avoids the instabilities that arise in some alternative layered-media formulations, and the provision of overlap integrals for standard basis functions lowers the barrier to implementation. These features constitute a practical advance for the targeted class of thin, highly conductive PCB structures.

major comments (1)
  1. Numerical Examples section: the two demonstrations are described at a high level, yet no quantitative error metrics (e.g., maximum |S_{ij} - S_{ij}^{ref}| or RMS deviation against a reference solver) are reported. Without such measures the claim that validity is demonstrated cannot be assessed quantitatively.
minor comments (1)
  1. Abstract: the statement that 'validity is demonstrated on two numerical examples' would be strengthened by a brief indication of the quantities compared and the observed level of agreement.

Simulated Author's Rebuttal

1 responses · 0 unresolved

We thank the referee for the positive evaluation and the recommendation of minor revision. We address the single major comment below.

read point-by-point responses
  1. Referee: Numerical Examples section: the two demonstrations are described at a high level, yet no quantitative error metrics (e.g., maximum |S_{ij} - S_{ij}^{ref}| or RMS deviation against a reference solver) are reported. Without such measures the claim that validity is demonstrated cannot be assessed quantitatively.

    Authors: We agree that the current presentation of the numerical examples is primarily qualitative. In the revised manuscript we will expand the Numerical Examples section to include direct quantitative comparisons against reference solutions (commercial full-wave solver or independent MoM implementation). For each example we will report the maximum absolute deviation and RMS error in the S-parameter values over the frequency range of interest, together with the reference data source. These additions will permit a quantitative assessment of accuracy while preserving the existing figures. revision: yes

Circularity Check

0 steps flagged

No significant circularity; derivation self-contained

full rationale

The paper derives the dyadic Green's function explicitly via the S-matrix formalism applied to a layered waveguide, expressing it in terms of three sets of S-matrices tied to source and observation layers. It supplies the MoM implementation details including overlap integrals for rooftop, volume pulse, and linear basis functions, plus two numerical validation examples. No quoted step reduces a claimed prediction or result to a fitted parameter or self-citation by construction; the central construction is presented as an independent analytic derivation rather than a renaming or tautology. The layered-waveguide model is stated as an assumption matching the target PCB class, not derived from the outputs. This is a standard self-contained computational electromagnetics method paper.

Axiom & Free-Parameter Ledger

0 free parameters · 2 axioms · 0 invented entities

The central claim rests on standard electromagnetic theory for stratified media and the assumption that thin conductive PCB features inside a simply shaped enclosure can be treated with 2.5D MoM.

axioms (2)
  • standard math Maxwell's equations in integral form govern the fields produced by currents in the layered dielectric host.
    Invoked as the starting point for deriving the Green's function via S-matrix recursion.
  • domain assumption PCB metallization layers are thin and highly conductive relative to the dielectric host, justifying the 2.5D surface/volume current model.
    Stated in the opening paragraph describing why the PCB modelling problem is amenable to 2.5D MoM.

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