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pith:2026:OQHPS6KSTACHXMOJM63PUMWRFM
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Dispersion-Engineered Terahertz Silicon Interconnects Enabling Terabit-Scale Data Links

Bodhan Chakraborty, Guillaume Ducournau, Hadjer Nihel Khelil, Nikhil Navaratna, Pascal Szriftgiser, Ranjan Singh, Thomas CaiWei Tan, Wenhao Wang

Dispersion-engineered unclad silicon waveguides enable 1.004 Tbps multi-band THz on-chip data links.

arxiv:2605.16841 v1 · 2026-05-16 · physics.optics

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4 Citations open
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Claims

C1strongest claim

We demonstrate a CMOS-compatible, centimetre-scale, multi-band on-chip THz data link achieving an aggregate throughput of 1.004 Tbps. The performance is enabled by suppressing Bragg-induced stopbands using dispersion-engineered, effective-medium-supported unclad silicon waveguides, resulting in flat transmission and low-ripple group delay across multiple THz bands.

C2weakest assumption

That the dispersion-engineered effective-medium-supported unclad silicon waveguides will reliably suppress Bragg stopbands and deliver the stated low propagation loss, bending loss, and GVD (0.15 ps²/mm) over the full 220-500 GHz band in fabricated devices without unaccounted penalties.

C3one line summary

Demonstrates dispersion-engineered unclad silicon THz waveguides enabling 1.004 Tbps aggregate throughput across multiple bands with low GVD and dual-polarization support in a CMOS-compatible platform.

References

33 extracted · 33 resolved · 0 Pith anchors

[1] Thraskias, C. A. et al. Survey of photonic and plasmonic interconnect technologies for intra- datacenter and high-performance computing communications. IEEE Commun. Surv. Tutorials 20, 2758–2783 (2018 2018
[2] Network the Cloud: The Critical Role of the Network in Cloud Evolution 2025
[3] Minkenberg, C., Krishnaswamy, R., Zilkie, A. & Nelson, D. Co-packaged datacenter optics: Opportunities and challenges. IET Optoelectron. 15, 77–91 (2021) 2021
[4] F., Han, C., Hu, Z., Nie, S 2022
[5] Sengupta, K., Nagatsuma, T. & Mittleman, D. M. Terahertz integrated electronic and hybrid electronic–photonic systems. Nat. Electron. 1, 622–635 (2018) 2018

Formal links

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Receipt and verification
First computed 2026-05-20T00:03:25.634131Z
Builder pith-number-builder-2026-05-17-v1
Signature Pith Ed25519 (pith-v1-2026-05) · public key
Schema pith-number/v1.0

Canonical hash

740ef9795298047bb1c967b6fa32d12b37027c0987a02802a6521a05112a3d75

Aliases

arxiv: 2605.16841 · arxiv_version: 2605.16841v1 · doi: 10.48550/arxiv.2605.16841 · pith_short_12: OQHPS6KSTACH · pith_short_16: OQHPS6KSTACHXMOJ · pith_short_8: OQHPS6KS
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curl -sH 'Accept: application/ld+json' https://pith.science/pith/OQHPS6KSTACHXMOJM63PUMWRFM \
  | jq -c '.canonical_record' \
  | python3 -c "import sys,json,hashlib; b=json.dumps(json.loads(sys.stdin.read()), sort_keys=True, separators=(',',':'), ensure_ascii=False).encode(); print(hashlib.sha256(b).hexdigest())"
# expect: 740ef9795298047bb1c967b6fa32d12b37027c0987a02802a6521a05112a3d75
Canonical record JSON
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    "license": "http://creativecommons.org/licenses/by/4.0/",
    "primary_cat": "physics.optics",
    "submitted_at": "2026-05-16T06:59:38Z",
    "title_canon_sha256": "b422a8880d00897349b4697375c5ac091f97e045e7a02e8b3c7eea2485cf3fd5"
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