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In-situ Synchrotron X-Ray Photoelectron Spectroscopy Study of Medium-Temperature Baking of Niobium for SRF Application

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arxiv 2312.06529 v2 pith:A2LHFD5V submitted 2023-12-11 physics.acc-ph cond-mat.mtrl-scicond-mat.supr-con

In-situ Synchrotron X-Ray Photoelectron Spectroscopy Study of Medium-Temperature Baking of Niobium for SRF Application

classification physics.acc-ph cond-mat.mtrl-scicond-mat.supr-con
keywords bakingniobiumsurfacedeterminedfluorinelayeroxygenx-ray
verification ladder T0 review T1 audit T2 compute T3 formal T4 reserved
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In the present work the chemical composition of niobium surface upon 200-400 {\deg}C baking similar to "medium-temperature baking" and "furnace baking" of cavities is explored in-situ by synchrotron X-ray photoelectron spectroscopy (XPS). Our findings imply that below the critical thickness of $Nb_2O_5$ layer (about 1 nm) niobium starts to interact actively with surface impurities, such as carbon and phosphorus. By studying the kinetics of the native oxide reduction, the activation energy and the rate-constant relation have been determined and used for the calculation of the oxygen-concentration depth profiles. It has been established that the controlled diffusion of oxygen when the native-oxide layer represents an oxygen source is realized at temperatures 200-300 {\deg}C, while at 400 {\deg}C the pentoxide is completely reduced and the doping level is determined by an ambient oxygen partial pressure. Fluorine (F to Nb atomic ratio is about 0.2) after the buffered chemical polishing was found to be incorporated into the surface layer probed by XPS (about 4.6 nm), and its concentration increased during the low-temperature baking (F/Nb up to 0.35 at 230 {\deg}C) and depleted at higher temperatures (F/Nb=0.11 at 400 {\deg}C). Thus, the influence of fluorine on the performance of mid-T baked, mild-baked (120 {\deg}C/48 h) and nitrogen-doped cavities must be considered. The possible role of fluorine in the educed $Nb^{+5}$ to $Nb^{+4}$ reaction under the impact of an X-ray beam at room temperature and during the thermal treatment is also discussed. The range of temperature and duration parameters of the thermal treatment at which the niobium surface would not be contaminated with impurities is determined for industrial applications.

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