Overcoming Quantum Resistivity Scaling in Nanoscale Interconnects Using Delafossite PdCoO2

Continued scaling into the sub 7 nm regime exacerbates quantum limited resistivity in Cu interconnects. We evaluated layered PdCoO2 and explicitly benchmarked it against Cu to identify mechanisms that maintain conductivity under confinement. Using a momentum resolved relaxation time formalism derived from the conductivity tensor, we link k and energy resolved velocities, life times, and mean free paths (MFPs) to thickness dependent resistivity for films and wires. PdCoO2 exhibits quasi 2D transport with high inplane velocities and strongly anisotropic MFPs (15 nm inplane, 3 nm outofplane near EF), whereas Cu shows an isotropic 22 nm MFP. Under identical boundary conditions including a realistic 2 nm liner/diffusion barrier for Cu, PdCoO2 displays suppressed boundary scattering and a much slower resistivity increase from bulk down to sub 30 nm, preserving near bulk conductivity and remaining viable at 2 nm. Thickness trends reveal dual slope changes in PdCoO2 (35 nm and 7 nm) set by anisotropic MFPs, contrasting with the single characteristic scale of Cu (40 nm). The calculated bulk values and scaling curves track available measurements for both materials. These results establish PdCoO2 as a scalable interconnect that outperforms Cu under quantum confinement and provide a quantitative framework to screen layered conductors for next generation nanoelectronic interconnects.