Stacked Intelligent Metasurfaces for Wireless Communications: Applications and Challenges

Bruno Clerckx; George K. Karagiannidis; Hao Liu; Jiancheng An; Lu Gan; Mehdi Bennis; M\'erouane Debbah; Tie Jun Cui; Xing Jia

Stacked Intelligent Metasurfaces for Wireless Communications: Applications and Challenges

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arxiv 2407.03566 v2 pith:UKZNUNUX submitted 2024-07-04 cs.IT eess.SPmath.IT

Stacked Intelligent Metasurfaces for Wireless Communications: Applications and Challenges

Hao Liu , Jiancheng An , Xing Jia , Lu Gan , George K. Karagiannidis , Bruno Clerckx , Mehdi Bennis , M\'erouane Debbah

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Tie Jun Cui

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classification cs.IT eess.SPmath.IT

keywords wirelesscommunicationssimsapplicationschallengeshardwareintelligentmetasurfaces

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The rapid growth of wireless communications has created a significant demand for high throughput, seamless connectivity, and extremely low latency. To meet these goals, a novel technology -- stacked intelligent metasurfaces (SIMs) -- has been developed to perform signal processing by directly utilizing electromagnetic waves, thus achieving incredibly fast computing speed while reducing hardware requirements. In this article, we provide an overview of SIM technology, including its underlying hardware, benefits, and exciting applications in wireless communications. Specifically, we examine the utilization of SIMs in realizing transmit beamforming and semantic encoding in the wave domain. Additionally, channel estimation in SIM-aided communication systems is discussed. Finally, we highlight potential research opportunities and identify key challenges for deploying SIMs in wireless networks to motivate future research.

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