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Suppression of quasiparticle poisoning in transmon qubits by gap engineering
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Suppression of quasiparticle poisoning in transmon qubits by gap engineering
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The performance of various superconducting devices operating at ultra-low temperatures is impaired by the presence of non-equilibrium quasiparticles. Inelastic quasiparticle (QP) tunneling across Josephson junctions in superconducting qubits results in decoherence and spurious excitations and, notably, can trigger correlated errors that severely impede quantum error correction. In this work, we use "gap engineering" to suppress the tunneling of low-energy quasiparticles in Al-based transmon qubits, a leading building block for superconducting quantum processors. By implementing potential barriers for QP, we strongly suppress QP tunneling across the junction and preserve charge parity for over $10^3$ seconds. The suppression of QP tunneling also results in a reduction in the qubit energy relaxation rates. The demonstrated approach to gap engineering can be easily implemented in all Al-based circuits with Josephson junctions.
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Cited by 1 Pith paper
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On-chip stencil lithography for superconducting qubits
An on-chip SiO2/Si3N4 stencil lithography mask enables shadow evaporation of Al Josephson junctions, demonstrated with transmon qubits achieving average T1 of 75 μs.
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